Used DISCO DFG 840 #293769761 for sale

DISCO DFG 840 is a top-of-the-line wafer grinding, lapping, and polishing equipment. This precision machine is versatile, precise, and user friendly, making it appropriate for a wide range of applications in the semiconductor, electronics, and other related industries. DISCO DFG840 features a large chamber area measuring 41.3" x 39.4" (105 cm x 100 cm) with maximum wafer size of 12" (30 cm). It also has a patented QuickChanger arm mounted on a linear guide system, which enables quick and secure arm exchange. The grinding wheel is a 200mm diamond wheel, and can be used for various materials including Si, SiC, and GaAs. The grinding spindle is electronically adjustable, with digital speed control to achieve precise processing results. DFG-840 also has a built-in lapping mechanism that is designed to increase wafer flatness and provides flat surface removal with minimum micro-scratching. The lapping process is CPU-controlled and follows a program that is stored in the memory. Additionally, the machine feature a two-speed polishing head. The polishing head allows for higher productivity and consistent polishing results and also offers high protection to fragile wafers. DFG 840 is equipped with intelligent safety features such as a hydraulic door interlock and an emergency stop button. Its advanced servo motor controlled Z-axis ensures high repeatability and sensitive force pressure adjustment. As a result, DFG840 is capable of achieving nanometer-level accuracy. The machine also features a user-friendly control unit with a touchscreen interface and self-diagnostic capability. Overall, DISCO DFG-840 is an advanced wafer grinding, lapping and polishing machine for producing the highest-quality products. It features precise grinding, lapping, and polishing operations, as well as intelligent safety features, ensuring maximum efficiency in production. As such, DISCO DFG 840 is ideal for a variety of industrial applications.