Used DISCO DFG 840 #293775101 for sale

DISCO DFG 840 is an automated wafer grinding, lapping and polishing equipment specifically meant for processing small and large pieces of quartz and silicon samples in semiconductor production. It is a versatile, easy to use machine and includes automated features that significantly reduce cycle times while maintaining a high level of precision. DISCO DFG840 is equipped with a powerful grinding spindle, paired with a single-post CNC system that ensures extremely accurate grinding and polishing operations. The unit comes with two main components: DFG-840 grinding chamber and DFG840 control unit. DISCO DFG-840 grinding chamber itself is closed, meaning that the environment inside the chamber is sealed off from the rest of the machine. This prevents any contamination from outside the chamber, and eliminates any risk of flying particles or possible electrostatic discharge, making it an optimal choice for use in cleanroom environments. The inside of the chamber is made of stainless steel and has an integrated Peripheral Edge Sanding (PES) brush, along with the grinding spindle, a water jacket and a cooling device. The grinding speed can be adjusted depending on the specific application, and the chamber is equipped with a vacuum machine to collect the slurry produced during grinding and to aid in the lubrication and cooling of the grinding surface. DFG 840 control unit is also equipped with a range of features, including program-controlled leaching and polishing with customizable programs, a timer that enables easy monitoring of the length of the grinding cycle and a full range of safety features such as interlock for the grinding chamber and automatic water level monitoring. DISCO DFG 840 is a highly precise machine and offers a wide range of customizable settings according to the specific applications of users. Its automated features drastically reduce cycle times, making it an effective and efficient tool for producing high-quality quartz and silicon substrates.