Used DISCO DFG 840 #293818104 for sale

DISCO DFG 840 is a 'wafer grinding, lapping & polishing' equipment, designed to improve efficiency and reduce cycle times in the production of complex microstructures. This system is an essential piece of equipment for the high-powered, high-precision manufacturing of microelectronics. DISCO DFG840 can process a wide range of materials from brittle to soft, from hard to soft and from conductive to insulating. This unit offers new levels of flexibility, enabling up to three different grinding processes to be combined into one, for maximum efficiency. Its compact size and highly automated operations allow for the efficient processing of multiple wafer types. The machine features two independent grinding and polishing stations, which can be used simultaneously for side face grinding, surface grinding, lapping and polishing on both sides of the wafer. The stations can also be used to accomplish close-tolerance grinding of extremely thin layers, as well as surface roughness control. DFG-840 utilizes an integrated platen loader and a water-cooled spindle, which operates at rotational speeds of up to 10,000 rpm, to provide maximum accuracy when grinding, lapping and polishing. The tool also features an integrated diamond grinding wheel, specifically designed to ensure high quality and uniformity. This asset utilizes advanced image processing technology and auto-grinding modes for fast and smooth processing, providing excellent repeatability and minimal abrasive loss. The unit also includes an integrated vision model, which optimizes the grinding process by providing accurate feedback on the surface condition of the wafer. DFG 840 is designed to offer significant improvements over traditional grinding, lapping and polishing systems, allowing manufacturers to achieve greater accuracy, precision and productivity. By combining cutting-edge technology with simplified operation, this equipment is an ideal choice for high-precision wafer grinding and polishing operations.