Used DISCO DFG 840 #9054571 for sale
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ID: 9054571
Wafer Size: 8"
Grinder, 8"
6" capable
Spindle type: air-bearing with high frequency motor
(2) Axes
Output (kW): 4, 2
Revolution speed (min-1 <rpm>): 1,000 - 7,000
Z-axis vertical stroke: 110mm
Z-axis vertical grinder feed speed 0.001 - 0.08mm/s
Height gauge:
Measurement range: 0 - 1,000um
Resolution: 0.1um
Repeatability: +/- 0.5um
Wafer chuck table:
Type: porous
Chuck methord: vacuum
Number of revolutions (min-1 <rpm>): 0 - 300
(2) Chuck tables
Spark out (chuck table revolution settings): 0 -999
Grinding wheel: diamond, ø200mm
Wafer handling / cleaning section:
(4) Cassette storage
Spinner unit;: water washing and drying
Vacuum unit:
Discharge speed: 29 / 36 m3/h (50/60Hz)
Achievable pressure (kPaxG): -90 (water supply temp. 15ºC, water supply flow rate 1L/min)
Electrical motor: 1.5kW
Water flow rate: 3L/min when supplied water temperature >22ºC
Grinding accuracy:
Thickness variation within one wafer: <1.5um
Thickness variation between wafers: <+/-1.5um
finish surface roughness: ~Ry 0.13um (with #2000 finish)
Utilities:
Power supply: 200VAC +/-10%, 3 phase, 50/60Hz
Power consumption: during processing 5.1kW; during warm-up 3.1kW
Max. power: 17KVA
Air pressure: 0.5 - 0.8 MPA*G
Water pressure:
Grinding / cleaning: 0.2 - 0.3 MPa*G
Cooling: 0.2 - 0.3 MPa*G
Vacuum pump: 0.052 - 0.49 MPa*G
Water flow rate:
Grinding / cleaning: 15L/min
Cooling: 6L/min
Exhaust duct capacity: 4 m3/min.
DISCO DFG 840 is a wafer grinding, lapping and polishing equipment specifically manufactured for the silicon wafer and other microelectronic substrate industry. The system consists of a heavy-duty, X-Y motion stage, a vacuum-backed grinding plate, and a precision spindle. A motorized lift mechanism allows for easy access to the grinding plate and spindle. The unit is capable of accommodating a variety of grinding/abrasive mediums and offers a wide range of grinding speeds for superior wafer grinding and lapping capabilities. The machine features a precision spindle for the grinding and lapping process. It runs at high speeds and provides optimized grinding and lapping operations for accurate, precise and repeatable results. The spindle is driven by a high-frequency PWM servomotor that is capable of controlling the speed and the depth of the wafer as it is machined. The power speed is adjustable for different wafer and grinding applications. The tool's X-Y motion stage is driven by a powerful AC synchronous drive motor, allowing for precise positioning and maximum accuracy. DISCO DFG840 wafer grinding asset also features a vacuum-backed grinding plate, which helps to reduce the spread of dust particles during the grinding and lapping process. A blasting gun is integrated into the machine to provide a uniform and dust-free grinding surface. The blasting gun ejects a stream of air which removes any excess dust particles that may be created during the grinding and lapping process. The model also has a number of sensors attached to it, ensuring that the wafer is always grinding correctly and within acceptance limits. DFG-840 is an ideal machine for precision wafer grinding, lapping, and polishing operations. Its versatile design makes it an ideal machine for a wide range of applications and industries such as automotive, aerospace, and microelectronics. The equipment's motorized lift mechanism enables operators to quickly and easily switch between different grinding and polishing plates, which helps to reduce machine downtime and increases productivity. With its wide range of accessories and precision grinding/lapping capabilities, DISCO DFG-840 is the ideal machine for a wide range of industrial and microelectronics applications.
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