Used DISCO DFG 840 #9056228 for sale

DISCO DFG 840 is an advanced equipment designed for wafer grinding, lapping, and polishing. It is an ideal choice for those looking to perform conducting or non-conducting wafer thinning processes quickly, accurately, and precisely. The system features an integrated sharpening machine, allowing users to precisely sharpen blades and scribes to produce a smooth finish on semiconductor materials. This allows for precise fabrication and polishing of small wafers with a high degree of accuracy and repeatability. The machine features an integrated grinding mechanism that utilizes multiple polishing pads to achieve the desired effect. This is achieved by having the polishing pads spin in opposite directions, while simultaneously pressing and releasing, resulting in excellent lap times and an optimized surface finish. The unit is capable of grinding metal, ceramic, and ceramic-metal materials with a high degree of accuracy and repeatability. It has a maximum thickness of 0.03 mm and can accommodate up to five grinding pads, resulting in a superior grinding quality and reduced material waste. DISCO DFG840 also provides a user-friendly interface. All parameters can be set through an easy-to-use control panel and a single remote control is used to control the machine. This allows users to select their desired parameters, adjust the grinding speeds, and monitor the machine's progress. The machine also includes an on-screen display to provide clear information about the current status of the grinding process. DFG-840 boasts high durability and consistency, ensuring accurate and repeatable wafer thinning operations with minimal operator intervention. Additionally, it has a modular design so that it can be easily serviced or modified as needed. The tool is also equipped with a touchless measurement asset, ensuring precise measurements of grinded material without any manual contact. This comprehensive wafer grinding, lapping, and polishing model is capable of producing superior results with short cycle times and minimum downtime. DISCO DFG-840 is an ideal choice for any laboratory or industrial application requiring fast, precise wafer thinning. With its excellent performance and user-friendly features, it is well-suited for those working in the semiconductor industry.