Used DISCO DFG 840 #9067727 for sale

DISCO DFG 840 wafer grinding, lapping and polishing equipment is a highly versatile machine designed to finish wafers to demanding specifications on the nanometer level. This machine is suitable for precision grinding, lapping and polishing of many different types of materials, including quartz, sapphire, silicon, glass, and various ceramics. The large working area (840 mm in diameter) allows for a wide range of material dimensions to be worked, from a single substrate up to a 12-inch wafer stack. DISCO DFG840 is equipped with a precision grinding wheel that can be finely adjusted to create a precise surface finish. An electro-polishing system (LAPMASTER) is also included in the configuration which can be used to impart a surface texture that is ideal for bonding or LED applications, without the need for additional polishing steps. This unit also features an adjustable speed motor for increased control over the grinding process. The machine is equipped with a built-in vacuum chuck which can hold wafers securely without affecting the wafer's surface quality. This feature ensures that any abrasive material will not set into the wafer's surface as it is being machined. The tool also has a perforated grit tray, which ensures a consistent level of grinding until the desired finish is obtained. The operator can also monitor the grinding progress with a set of LED indicators located at the front of the unit. DFG-840 is a cost-effective solution for achieving a high level of precision in the grinding, lapping, and polishing of a variety of materials. It is perfect for the production environment, as it can easily and quickly produce a uniform, high quality finish for a wide range of applications. With its easy-to-use interface and adjustable settings, it is ideal for quick and efficient production runs.