Used DISCO DFG 840 #9119556 for sale

DISCO DFG 840 is a wafer grinding, lapping & polishing equipment manufactured by DISCO Hi-Tec Corporation of Japan. It is designed for processing wafers for a variety of processes such as back grinding, lapping, and polishing. The system consists of a work table, grinding wheel, polishing pad, and associated components to perform the various functions. The work table is enclosed in a housing to protect the grinding wheel and polishing pad. It has an X-Y axis drive mechanism to enable precise positioning during wafer processing operations. The grinding wheel is an abrasive type wheel that is driven by a motor to rotate at high speed in order to grind the wafer surface. The polishing pad is a specialty type pad that is designed for polishing and finishing of the wafer. It can be adjusted to provide various levels of polishing. In operation, the wafer is placed on the work table and the motion of the X-Y axis drives positions the wafer as needed. The grinding wheel is then used to abrade the wafer surface in order to achieve the desired shape. The process is repeated with the polishing pad in order to produce a high degree of surface finish. The unit can also be used for lapping operations, where abrasive particles suspended in a lubricating solution are used to smooth the wafer. DISCO DFG840 offers a variety of features such as programmable grinding paths, auto-focus functions, and the ability to measure and control the thickness of the wafer. The machine also has optional features such as wafer rotation for more precise processing and the ability to monitor the process with video inspection. The tool is designed for use in demanding and critical wafer processing operations such as for flat panel displays, microelectronics, and MEMS processes. Overall, DFG-840 is a robust and reliable wafer grinding, lapping & polishing asset suitable for a wide range of wafer processing applications. With its precise positioning, high-speed grinding, and automated functions, the model is designed to provide consistent and reliable results in the most demanding wafer processing operations.