Used DISCO DFG 840 #9144828 for sale

DISCO DFG 840 is a high-precision wafer grinding, lapping and polishing equipment for the most exacting applications. It is a sophisticated, multi-purpose solution for the surface roughness and flatness of various materials, ranging from fine grain to ultra-hard materials such as SiC, diamond and cubic boron nitride. The system can process both single-sided and double-sided wafers with thickness ranging from 0.02mm to 8.0mm and up to 150mm wafer diameter. DISCO DFG840 features a powerful, intuitive CNC control interface, a high-precision grinding spindle for exacting lapping and polishing processes, and an ultra-precise air bearing stage for repeatable results. The grinding spindle is driven by a powerful motor that generates a maximum torque of 320 Nm and forces of 1000N. It is equipped with a lot of features such as low-vibration preload and high-level data interface capability with up to 32 output channels. To ensure excellent performance, DFG-840 offers an advanced wafer support unit which includes various positioning and clamping systems for various materials. The machine also features a fast and intuitive alignment tool with an auto-calibration function for added accuracy and repeatability. The asset also comes equipped with a comprehensive wafer edge Grinding Software Suite to automate processes such as edge grinding for wafers, dicing, etc. The model is designed to provide end-users with a comprehensive and seamless grinding, lapping and polishing experience. Its advanced design allows for high levels of automation and accuracy. The equipment is also designed to conform to various safety regulations, such as those pertaining to hazardous dust particles. DFG840 is an advanced, high-precision wafer grinding, lapping and polishing solution perfect for any demanding applications. Its combination of precision, automation and versatility make it the ideal solution for any job.