Used DISCO DFG 840 #9148292 for sale

DISCO DFG 840 is a wafer grinding, lapping, and polishing equipment manufactured by DISCO. This system is used to grind, lap, and polish wafers used in semiconductor manufacturing. It is designed to enable efficient grinding, lapping, and polishing of wafers with excellent surface quality. DISCO DFG840 unit is capable of handling wafers up to 8 inch in diameter. It features two completely independently operating rotary and stationary conditions, allowing for simultaneous grinding, lapping and polishing on different wafers at the same time. The machine is also equipped with a high-precision linear motor drive, realizing high-speed and high-precision processing. DFG-840 is suitable for the use on a variety of wafer materials, including silicon, sapphire, and gallium nitride. This tool is ideal for grinding, lapping, and polishing of wafers with precise control of thickness, which helps to improve yielding during semiconductor device fabrication. The asset features an user-friendly graphical user interface with various operator-selectable functions. It also features a feedback loop for controlling the grinding, lapping, and polishing conditions, allowing for precise control and accuracy. The model has a wall-pressure automatic compensation equipment, automatically compensating the wall-pressure when the wafer thickness differs from setpoint. This ensures the accuracy of the process and minimal deviation from the desired thickness range. DFG 840 system is manufactured following ISO 9001 specifications and requires very little maintenance, with parts replacement and cleaning procedures that are easy to perform. The unit also features a transparent hood for maintaining a dust-free environment during wafer processing. Overall, DFG840 wafer grinding, lapping, and polishing machine is a high quality tool with excellent performance for grinding, lapping, and polishing of silicon, sapphire, or gallium nitride wafers. The asset has excellent process control features, user-friendly graphical user interface, and wall-pressure automatic compensation model for precise and accurate wafer processing. This equipment is ideal for thin wafers with tight thickness tolerance in semiconductor device fabrication.