Used DISCO DFG 840 #9226640 for sale

DISCO DFG 840 is a versatile wafer grinding, lapping and polishing equipment designed for use in the semiconductor industry. It is capable of grinding, lapping and polishing wafers with a diameter ranging from 50mm to 8". The system incorporates a high performance grinding and polishing spindles, each of which features variable speed capability with both air and water cooling options. Both the grinding spindles and the polishing spindles are mounted on a bridge, allowing multislot batches to be ground in one pass. Additionally, the conveyor mechanism is designed to allow both wet and dry processing, with a load lock for greater accuracy. The unit is equipped with an auto-loading arm for improved automation and efficiency, as well as a vision-guided wafer centering machine for precise wafer placement. The spindles are integrated with an advanced motion control tool, which allows for controlled and precise grinding and polishing operations. The grinding and polishing processes can be programmed to be executed automatically, and the asset includes a safety interlock model to ensure that the spindles are always in the proper position during operation. DISCO DFG840 is constructed from high-quality components and uses advanced technologies, such as the integrated encoder, to help ensure higher accuracy and repeatability. The equipment uses an easy-to-use graphical interface, allowing the operator to monitor and adjust the process parameters. Additionally, a touch panel is installed on the front of the machine for convenient and intuitive operation. DFG-840 is suitable for many grinding, lapping and polishing processes, including hard-to-machine materials such as carbon, silicon, and gallium arsenide. Joystick-type controls offer precise and repeatable results, while the included force sensor further enhances the precision of the grinding and polishing processes. A variety of optional attachments and fixtures are also available, such as the Automatic Wheel Loading System (AWLS) for added convenience. The unit is compliant with ESD regulations, making it ideal for use in the semiconductor industry. DFG 840 is a powerful and versatile machine for grinding, lapping and polishing of semiconductor wafers, providing maximum efficiency and accuracy for all types of operations. The various advanced mechanisms and components integrated in the tool ensure superior performance, and the convenient and intuitive user interface simplifies operation.