Used DISCO DFG 840 #9248605 for sale

DISCO DFG 840 is a wafer grinding, lapping and polishing equipment for use in the semiconductor industry. It is specifically designed for producing high-performance wafers through a combination of advanced technology, enhanced process capacity and full process control. The system incorporates the latest in grinding and polishing technology, with enhanced reliability and cost efficiency. DISCO DFG840 can process both standard and large wafers up to 200mm in diameter. It features a high-resolution chuck, which provides the ability to precisely and accurately grind and lap samples. It also incorporates an intuitive programmable control unit with fully-adjustable parameters to ensure a consistently high-precision output. The machine's advanced grinding and polishing head is equipped with a three-axis drive tool to allow for optimal grinding and polishing on all face orientations. It is also capable of performing single-pass grinding and polishing, as well as two- and three-pass grinding operations. The asset's grinding head utilizes a dynamically balanced motor to ensure very low vibration, while its patented 'load-distributed' grinding model ensures uniform grinding forces and consistent high-precision results. The equipment is designed for improved safety and operator comfort. Its non-contact dust extraction system dramatically improves air quality, while its self-service maintenance unit makes it easy for operators to quickly change consumables and carry out machine checks. DFG-840 is highly efficient at producing wafers of the highest precision. It features programmable speed, pressure and temperature control for maximum accuracy, and its specialized lapping plates provide superior quality polishing. The tool also includes a host of safety features, including temperature and pressure sensors for monitoring process efficiency. In conclusion, DFG 840 offers an efficient, reliable and cost-effective solution for grinding, lapping and polishing semiconductor wafers.Its advanced grinding and polishing technologies, enhanced process capacity and full process control ensure a consistently high-precision output.