Used DISCO DFG 840 #9250102 for sale

DISCO DFG 840
ID: 9250102
Wafer Size: 6"
Grinder, 6".
DISCO DFG 840 is a wafer grinding, lapping and polishing equipment designed to finish and fine-tune all kinds of semiconductor components. It is a multi-purpose machine composed of three main parts: a wafer grinder, a lapping machine and a polisher. The wafer grinding part of the system consists of an upper and lower grinding wheel, each of which can be adjusted to different speeds and angles. The precision-controlled abrasive particles on the grinding wheels allow for precise grinding of the surfaces of the semiconductor components. The lapping component of the unit consists of two lapping plates, which are used to generate an even, fine finish on the surfaces of the component. The lapping plates can be adjusted in different angles and speeds to optimize the lapping results. The polishing part of the machine is composed of a polishing plate and a pad, which are used to generate a smooth, polished finish on the surfaces of the components. The polishing plate can be adjusted in different angles and speeds to optimize the results. DISCO DFG840 tool is highly automated and user-friendly, and it is equipped with various safety features, such as steel covers and safety auto-stop. The integrated control panel allows the user to precisely monitor and adjust the grinding, lapping and polishing process, and it also provides real-time feedback on the process. The asset is built specifically for the production of higher-quality, cost-effective components. In addition to finishing and fine-tuning high-quality semiconductor components, DFG-840 model can be used to clean and resurface optical of devices. It also can be used to etch and deburr plates as well as perform ultrasonic grinding. The precision of the equipment makes it perfect for applications in the optics and semiconductor industries. DFG 840 is a fully automated, multi-purpose system that offers a high level of precision and accuracy, as well as excellent safety features. Its user-friendly interface and ability to process different materials make it an ideal choice for both small-scale and medium-scale production in the semiconductor and optoelectronics industries.
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