Used DISCO DFG 840 #9263043 for sale

DISCO DFG 840 is a compact, all-in-one wafer grinding, lapping and polishing equipment designed to handle multiple applications within a single machine. It has a maximum processing speed of 14 cuts per second for accurate grinding and polishing times, and a maximum workpiece size of 8 inches or 20 cm. The system comprises of two stages, both equipped with motorized and air bearing spindles, and a vision unit for enhanced yield and precision. The first stage is designed for wet grinding and uses diamond-embedded grinding discs to perform the wafer grinding process, with a single grinding wheel that can be changed to accommodate different abrasives. The second stage is a polishing stage that uses lapping and polishing plates to achieve ultra-fine surfaces up to 0.2 nanometer flatness on the wafers. The machine is also capable of performing surface texture reading to detect possible defects. DISCO DFG840 features a fully-automated tool, equipped with intuitive commands and automated data logging, which enables the users to easily control and monitor the asset performance. The model also has a built-in temperature control equipment which provides optimal processing conditions for the grinding and polishing stages. DFG-840 features a multi-purpose design that can be adapted to a wide range of applications and is capable of processing wafers up to 8" in diameter with a maximum thickness of 0.6 mm. The system is exclusively designed for wafers, but can be modified to accommodate advanced packaging substrates, such as Through Silicon Vias (TSV) and Through Mold Cavities (TMC). The unit was designed with safety in mind. The entire machine is controlled by a PC which offers easy operation and control, and features an interlocking tool for safe operation. The integrated safety asset ensures that all components of the line are protected from possible accidents. Overall, DISCO DFG-840 is an all-in-one wafer grinding, lapping and polishing model that is highly versatile and requires minimal maintenance. It offers a high degree of accuracy and precision, enabling wafer manufacturers to take advantage of large scale production and high yield. The equipment is also renowned for its robust design and supports a wide range of applications.