Used DISCO DFG 840 #9268602 for sale

DISCO DFG 840 is a state-of-the-art wafer grinding, lapping and polishing equipment, designed to provide the highest quality machining performance for precision compound semiconductor wafer processing. This system is suitable for a wide range of wafer sizes, from 100 mm up to 8 inches. It features a unique modular structure, with dedicated function modules for grinding, lapping and polishing, plus an advanced moving plate unit, which allows for maximum flexibility and efficient operation. Its advanced technologies and heavy-duty construction ensure long-term stability and reliability. DISCO DFG840 includes a high-performance grinding unit, with a top-of-the-line 220V AC spindle motor and adjustable speed control for precision grinding processes. The grinding spindle is mounted on a rigid frame for vibration dampening and precise machining, to achieve the highest quality output. This machine also features a high-precision lapping unit, which utilizes servomotor-driven troughs to gradually lap the wafer to a flat and even surface. Additionally, the polishing module utilizes a combination of programmable servomotors and manually adjustable speeds, so that the user can choose the most suitable surface treatment for the wafer. DFG-840 also features a number of safety features, including interlocks, emergency shut down systems, and automatic motor shut offs to protect the operator. Finally, the pool-type design of the tool ensures efficient heat dissipation, and ensures that the asset operates at a consistent temperature, thus preventing any inconsistencies in the machining process. In summary, DFG840 wafer grinding, lapping and polishing model is a state-of-the-art equipment, designed to provide the highest quality output with maximum efficiency and flexibility. Its advanced technologies and well-constructed frame further ensure long-term stability and precision in machining, and its safety features provide extra safety for the user. It is a top-of-the-line system, suitable for a wide range of applications and wafer sizes.