Used DISCO DFG 840 #9281950 for sale

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DISCO DFG 840
Sold
ID: 9281950
Wafer Size: 4"-8"
Vintage: 1995
Back grinder, 4"-8" 1995 vintage.
DISCO DFG 840 is a precision wafer grinding, lapping and polishing equipment designed to create the highest quality of flat and highly smooth surfaces on any size wafer or substrate. DISCO DFG840's cutting-edge technology is capable of achieving high precision and surface finish, as well as superior control of the grinding and polishing parameters. The system is equipped with an innovative robotic loader and automated wafer stages, allowing for simple and efficient operation. In addition, DFG-840 features an optimized user interface for easy setup and operation. The main components of the unit include the grinding stage, lapping stage, and polishing stage. The grinding stage utilizes two linear motor-driven diamond grinding wheels to quickly grind away material from the wafer's surface with precision. The lapping stage then uses timed flat lapping plates to align the wafer surface and create an even finish. The polishing stage is capable of achieving the highest possible surface finish and flatness characteristics using two motor-driven polishing heads that apply adjustable, uniform pressure to the wafer's surface. DFG 840 also features a range of integrated safety features, such as air monitoring and machine guards, to ensure operator safety and protect machine parts from damage. In addition, its fully automated, robotic wafer loading and unloading tool is capable of handling wafers of any shape or size. The asset also boasts an intuitive "teach-in" function, allowing users to easily program the machine's movements and steps. Finally, it also features a fully-integrated, interactive colour touch panel control model for complete and easy monitoring of the wafer grinding, lapping and polishing process. In summary, DISCO DFG-840 is an innovative and highly precise wafer grinding, lapping and polishing equipment that is capable of producing high quality flat and polished surfaces on any size wafer or substrate. Its innovative features, automated functions and safety measures make it an ideal system for any manufacturing application.
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