Used DISCO DFG 840 #9395413 for sale

DISCO DFG 840 Wafer Grinding, Lapping & Polishing Equipment is a high-precision, single-pass wafer processing system. It is designed to quickly process silicon and compound wafers, such as gallium arsenide, using precision polishing processes. It can also integrate into existing production lines or serve as a standalone unit. The machine's main body features a sturdy, cast aluminum construction with distinctive "U-shaped" surfaces that provide even and consistent table movements. This ensures accurate control and repeatable results. The tool also utilizes a built-in high-resolution CCD camera and autofocus asset for precise wafer alignment. DISCO DFG840 features a water-cooled, high-torque, direct drive motor for precise fine grinding of wafer surfaces. It also has a high-precision spindle motor, enabling efficient lapping and polishing of wafer edges and surfaces. A speed control model moderates the equipment's motion and allows the operator to adjust grinding, lapping and polishing speeds, according to the shape and size of the wafer being processed. A dust collector, located behind the main body, collects any detritus or residue created during wafer processing operations. It can be adjusted to a specific air flow speed, giving the operator precise control over the dust concentrations in the air. DFG-840 is designed to minimize airborne particles, minimize dust generated by lapping and polishing processes and reduce motor noise to maximize its processing accuracy. The system also utilizes a fluid-control unit to allow easier switching between grinding and lapping processes. DFG 840 Wafer Grinding, Lapping & Polishing Machine can process any material up to a size of 3 in. (76.2 mm). It is capable of delivering highly accurate processing operations, ensuring wafers are processed with the highest levels of precision. Its robust construction and excellent dust collection tool make it ideal for a wide range of wafer applications.