Used DISCO DFG 840 #9407183 for sale

DISCO DFG 840 is a wafer grinding, lapping and polishing equipment suitable for processing a diverse range of materials. DISCO DFG840 is used to achieve superior planar grinding, lapping and polishing of semiconductor, solar and MEMS wafers of up to 8 inches in diameter with superior throughput and quality. DFG-840 features a fully automatic wafer truing function which accurately positions and aligns the wafer during each processing step. The truing function ensures that the wafer is consistently processed in the same location, thus reducing the risk of edge damage and errors. The wafer is securely mounted within a vacuum chuck to ensure that it is still during the entire process. The chuck also ensures that no outside contanimants enter the chamber. The integrated diamond grinding wheel and polishing wheel are able to process both semiconductor and solar wafers, while the integrated lapping wheel is specifically designed to process MEMS wafers. The grinding wheel ensures smooth and uniform grinding of the wafer, while the polishing wheel ensures a glossy, wear-resistant product. The lapping wheel is able to grind, lap and polish wafers simultaneously. DFG 840 features a 4-axis indexer which allows for quick retooling between the different natural modes. The indexer can be configured to travel in an X-Y pattern, allowing for larger wafers to be processed. The system also features a 4-axis CNC control unit with touch screen interface. This enables the easy and efficient control of the entire process, from the automatic truing to the selection of the grinding and polishing wheels. The unit has an integrated dust free, zero-emission design, ensuring that any dust particles that are generated during the process are quickly filtered before exit. DISCO DFG-840 is highly customizable and can be configured to meet the specific requirements of the user or application. The machine can also be integrated with other wafer processing systems for further enhanced accuracy and throughput.