Used DISCO DFG 840HS #9054572 for sale

DISCO DFG 840HS is a state-of-the-art wafer grinding, lapping, and polishing equipment designed to enable advanced process control and precision in semiconductor device manufacturing processes. This system is the newest model in the highly acclaimed DISCO family of process grinding, lapping, and polishing systems and offers the latest innovations and engineering designs that reflect the most advanced industry standards in equipment manufacturing. The 840HS includes a high-speed grinding wheel base unit, an automated lapping machine base, polishing heads, and several other components that can be customized for specific wafer processing requirements. The grinding and lapping process is driven by high-frequency spindle motors and the polishing is accomplished using a unique proprietary stepping motor technology. This technology ensures the highest levels of process accuracy and control during the grinding, lapping, and polishing stages while minimizing operator fatigue and maintenance requirements. The 840HS unit features a combination of innovative spindles and drives that work in tandem to form an advanced wafer grinding, lapping, and polishing process. This machine also includes a number of additional components that facilitate consistent and precise operation. For example, the polishing includes a highly advanced tension roller tool that helps to maintain uniform wafer tension during the polishing process while preventing wafer deformation or damage. The automated lapping process in the 840HS is fully automated with a highly accurate repeatability. This process utilizes a calibrated oil pump to precisely control lapping parameters, while a special linear drive asset ensures precision grinding and uniform lapping of wafers. The 840HS is also equipped with an advanced process monitoring model featuring color-coded graphics and a touch-screen dashboard that provide graphical feedback regarding process execution accuracy. To ensure process consistency, the 840HS also features a range of advanced sensors and metrology systems. This equipment includes state-of-the-art temperature, vibration, and pressure monitoring sensors that detect anomalies in process parameters and help adjust the parameters in real time. This helps maintain the highest levels of process accuracy and control while minimizing operator fatigue and idle time. Overall, DISCO DFG 840 HS is an advanced process leveling, grinding, lapping, and polishing system that provides the highest levels of accuracy and precision in semiconductor device fabrication. The combination of its automated lapping, high-precision spindle motor technology, and user-friendly interface make it the perfect choice for any semiconductor device process-leveling applications.