Used DISCO DFG 840HS #9069524 for sale

DISCO DFG 840HS is an ultra-precision wafer grinding, lapping, and polishing equipment designed to deliver precise finished product results with tight surface waviness measurements even at production speed. Featuring a polyimide based cast iron construction with a polyimide upper platen, DISCO DFG 840 HS has a high thermal stability with superior vibration damping that suppresses micro-process vibration to enable processing at high speed. DFG 840HS has a dresser stroke of 800mm with a rotary holder feed speed of up to 300mm/min. DFG 840 HS is equipped with an integrated vibration feed mechanism for consistent process stability. The AC motor driven grinding head features low inertia and a low natural frequency to enable high speed operation and suppress micro-vibrations. The adjustable rigidity of the drive system matches the structural elements of the machine, such as the base and head, which ultimately improves the precision of the finished product results. The head of DISCO DFG 840HS is capable of angle changing from 0 to 90 degrees in 1 degree increments, allowing for optimal control when adjusting the feed speed. The unit is also capable of automatically compensating for the grinding wheel wear, ensuring a consistent surface finish quality. DISCO DFG 840 HS employs an intelligent mutual operation function, which is equipped with an auto-measurement machine to continuously monitor the grinding progress. This tool also has an intelligent control program which can adjust the head angle and the grinding wheel wear. On top of that, the auto-measurement asset monitors the progress of the grinding process so that even the most delicate tasks can be accomplished with strong accuracy. The post-terminal of DFG 840HS is equipped with comprehensive data feedback software for quality control, allowing for efficient defect inspection. DFG 840 HS is highly reliable and efficient, delivering outstanding performance and quality results. With its patented grinding head, advanced control program, and auto-measurement model, DISCO DFG 840HS is an ideal choice for precision wafer grinding, lapping, and polishing tasks. In conclusion, DISCO DFG 840 HS is a powerful, dependable, and highly precise equipment designed to deliver optimal results in wafer grinding, lapping, and polishing. With its superior performance, adjustable rigidity, and intelligent monitoring systems, DFG 840HS is the ideal all-in-one solution for precision wafer surface finish requirements.