Used DISCO DFG 840HS #9119673 for sale

DISCO DFG 840HS is a precision semiconductor wafer grinding, lapping and polishing equipment for use in semiconductor manufacturing facilities. The system harnesses the latest in grinding and polishing technology to realize ultra-precise, high speed grinding and polishing of submicron features, as well as production of optically flat surfaces with fewer defects. To ensure the highest quality results, DISCO DFG 840 HS employs a combination of high speed grinding, lapping and polishing technologies. Its grinding head utilizes a rotating diamond wheel with a controlled flatness of 0.5μm, and its unique control unit maintains a precise grinding force of between 0.5 and 3.2 N/mm. The diamond wheel employs a sophsticated patterning technology to optimize grinding results while avoiding subsurface damage. In addition, the machine contains a two-step lapping plate, featuring a low-roughness aluminum oxide lapping plate and a high-roughness diamond lapping plate. The tool also employs a cross-slide polishing head which utilizes a combination of linear and rotary motion to achieve high-quality surface finishes. The asset contains a digital motor that controls the motor speed and direction, allowing for precise and repeatable motions. The motor also contains a patented feed control model, which limits the load on the wafer to ensure that no damage occurs during polishing operations. The equipment is also equipped with a variety of measurement and analysis tools to ensure the quality of the results. It includes a 3-axis surface inspection system, with a CCD camera loaded on a forced diving microscope. This allows the user to measure the flatness and step height of wafer solids, making it possible to detect any potential scratching, fractures, and other irregularities. In addition, a resistivity machine allows for measurements of thin-film thickness and uniformity, eliminating the need for manual inspection. Overall, DFG 840HS is a powerful and innovative semiconductor wafer grinding, lapping and polishing unit that is capable of achieving precise and repeatable results with minimal defects. Its inclusion of advanced grinding and polishing technologies, as well as various measuring and analysis tools, make it an invaluable asset to wafer fabrication facilities.