Used DISCO DFG 840HS #9144829 for sale

DISCO DFG 840HS is a state-of-the-art wafer grinding, lapping and polishing equipment designed for precision applications.It performs all the necessary grinding, lapping, and polishing operations necessary to produce high-precision wafers with high surface finishes and high parallelism. DISCO DFG 840 HS is ideal for applications that require high levels of precision and uniformity, such as microelectronics and semiconductor devices. DFG 840HS utilizes two precision grinding wheels, which can grind efficiently from start to finish to ensure high-precision results. The first grinding wheel is designed to remove surface defects and shape the wafer, while the second wheel refines the surface, providing a smooth and uniform finish. DFG 840 HS is also outfitted with a four position, simultaneous polishing system, which allows a maximum polishing speed of up to 500 rpm. With this unit, the user can achieve an impressive surface roughness of less than 0.5µm, providing a highly polished finish and superior uniformity on the wafers. The machine also features a modular servo drive machine, providing precise speed control for uniform, high-precision results. The entire tool is also highly automated for maximum productivity, with intuitive graphical interfaces and a powerful programmable logic controller (PLC) to manage the entire process. Additionally, the machine is capable of producing wafers with a minimum diameter of 25 mm, and a maximum diameter of 150 mm. For added safety and convenience, DISCO DFG 840HS also comes equipped with several user-friendly features, such as a laser interlock, safety-rail separator, and a built-in cleaning station. The laser interlock automatically shuts off the power when the arm is opened, while the safety-rail separator asset prevents objects from entering the machine during operation. Finally, the built-in cleaning station allows users to maintain and clean the machine before and after use without needing additional tools or equipment. Overall, DISCO DFG 840 HS is an excellent choice for grinding, lapping and polishing of high-precision wafers. Its innovative design and high-performance features make it an ideal solution for any application that requires precision results.