Used DISCO DFG 840HS #9200938 for sale

DISCO DFG 840HS is a wafer grinding, lapping and polishing equipment designed to perform precision surface reshaping, polishing and lapping operations on large-sized materials such as Silicon Wafers, LCD Panels and Hard Disks. It provides operators with high-precision grinding and lapping operations simultaneously, at different cutting speeds and loadings. The system is equipped with a large, flat lapping/dressing surface to ensure consistently superior results. Utilizing a large, low-pressure top plate, this unit can process many different types of wafers including monocrystalline silicon and multi-crystalline silicon wafers. A high-accuracy laser scanner is included in the machine to provide real-time feedback on the surface quality and surface integrity. The central component of the tool is the grinding/lapping/polishing head, which features a single, direct-drive motor and several speeds for different finishing requirements. The grinding head is adjustable, allowing for multiple grinding speeds for different materials as well as a variety of cutting depths and feed rates. The rotating disc and bowl of the grinding/lapping/polishing apparatus provide high speed and uniformity in wafer grinding and lapping operations. The advanced, direct-drive technology also provides continuous force feedback while in operation, ensuring precise cutting and polishing results. Additionally, the asset features a load-sensing air pressure model and an emergency stop switch for added safety during grinding and lapping operations. A highly-intuitive control panel with a touchscreen interface is included to streamline the equipment's user experience. DISCO DFG 840 HS is an ideal system for those looking for a reliable and cost-effective means of performing precise grinding and polishing operations on large materials. With its powerful and easy-to-use grinding head, advanced laser scan feedback and intuitive user interface, this unit is a great choice for grinding and lapping operations.