Used DISCO DFG 840HS #9212149 for sale

DISCO DFG 840HS is a versatile, precise and highly efficient wafer grinding, lapping and polishing machine. Built for both laboratory and in-line production applications, the equipment is designed to process a wide variety of wafer substrates with various film thicknesses and surface finishes. It features a large working area with a variable-height design to accommodate different sample shapes and sizes. High-precision linear drives on the X, Y and Z axes enable superior motion control and minimize time-consuming manual adjustments. The system integrates a powerful grinding and lapping component with advanced polishing capabilities. It offers two grinding methods, namely, an inner pad grinding method and an outer ring grinding method, which can be used to grind and polish wafers simultaneously. Advanced AC servo motor technology ensures high consistency and precise grinding performance with minimized environmental impacts. In addition, its easy operation and intuitive displays let users easily monitor the machining progress, making it easier to adjust parameters according to application needs. DISCO DFG 840 HS also integrates highly efficient polishing capabilities using ever-polishing and single-stroke polishing processes. The ever-polishing method requires only a single layer of polishing, offering increased throughput and minimizing changes between jobs. The single-stroke polishing method enables layers of precise controlled polishing, allowing for high precision polishing of large substrates. DFG 840HS is equipped with cutting-edge machine control platforms, including a powerful CNC controller, that provide for full real-time monitoring and data tracking of Wafer grinding, lapping and polishing processes. The integrated motion control unit achieves high precision by using a highly closed loop control loop, and data is quickly acquired and shared for improved analysis and process optimization. The machine also features a variety of programmable safety machine functions, ensuring user safety when grinding, lapping and polishing material. Overall, DFG 840 HS is an ideal tool for wafer grinding, lapping and polishing applications. Its versatile design, high precision level and effective safety measures make it a perfect fit for a wide variety of applications. The machine promises excellent results in minimal time, making it a great addition to any production line.