Used DISCO DFG 840HS #9394995 for sale

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ID: 9394995
Flattening grinder 1996-1997 vintage.
DISCO DFG 840HS is a high-precision, professional-grade wafer grinding, lapping and polishing equipment designed for semiconductor and flat-panel display (FPD) applications. The system combines high-quality mechanical grinding and polishing mechanisms with a proprietary control unit and a range of features and options for superior automation and efficiency. The machine's unique characteristics and design features make it the ideal choice for applications ranging from prototyping to volume production of today's most demanding flat-type wafers and substrates. DISCO DFG 840 HS wafer grinding, lapping, and polishing tool is designed to process both hard and soft wafers with parallel processing of multiple substrates at once. The asset uses a 1000 mm grinding, lapping, and polishing plate equipped with a powerful 1,550 VA motor, allowing for polishing to sub-micron-level accuracy. The high-precision grinding plate is capable of up to 1,800 rpm and up to 1.25 µm accuracy, while three separate polishing plates can accommodate stainless steel, resin, and polishing clothe. The model also comes with a full range of advanced software-controlled features and options, including autofocus, WPC (waveform process control) for non-contact and non-destructive process control, PNP (pattern-based process control) for advanced process monitoring and control, and advanced error correction for fast and accurate sample processing. DFG 840HS is equipped with a range of advanced safety features, including a front-panel emergency switch, an interlock switch, a safety shield, and a centrifugal safety clutch for increased processing safety. The equipment features a password-protected menu system to protect user data, as well as an environmentally friendly, low-power consumption design. With an automated lift table and unloading unit, the machine is capable of efficient and repeatable automated sample handling. DFG 840 HS is designed to provide superior results in wafer grinding, lapping, and polishing. Equipped with a highly sophisticated control tool, this asset enables the easy operation of complex processes with the reliability and precision required for high-volume production. It is an essential tool for applications ranging from mass production to prototyping.
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