Used DISCO DFG 841 #187798 for sale

DISCO DFG 841 Wafer Grinding, Lapping & Polishing equipment is a high-precision process for accurately grinding, lapping, and polishing wafers in the semiconductor industry. It is designed to achieve a consistently high level of accuracy, reproducibility, surface quality, and throughput. This system features an intuitive user interface, advanced CNC steps, single-side operation, and a wide range of wafer processing capabilities. The unit's main components consists of three separate machines that are mounted on one base. The first machine is the spindle drive, which is responsible for rotating the wafer and controlling it's speed during the grinding, lapping, and polishing processes. The second machine is the X-Y stage, which is responsible for accurately moving the wafer in two axes during the lapping and polishing processes. The third machine is the vision machine, which captures and compares images of the processed wafer at different stages of the cycle. The grinding, lapping, and polishing processes are each powered by a separate central processing unit (CPU), and each process is driven by the relevant CPU. The grinding process is controlled via real-time feedback to ensure accuracy, while the lapping and polishing processes are automated and completed using highly-accurate algorithms. The tool is designed to handle wafers that are up to 150mm in diameter and 10mm in thickness. In addition, DISCO DFG841 features advanced troubleshooting capabilities to quickly diagnose and resolve machine issues. The asset is also designed to reduce downtime and minimize scrapping. The model is capable of carrying out a variety of wafer processing jobs, including grinding, lapping, polishing, etching, and deburring. Various quality checks are included in each process, and parameters can be adjusted to suit individual applications. This equipment is designed to maintain a consistently high level of accuracy, reproducibility, and surface quality, while also minimizing downtime and waste. Many of its components are made from corrosion-resistant stainless steel to ensure long-term reliability and performance. DFG 841 Wafer Grinding, Lapping & Polishing system is a versatile and cost-effective solution for this demanding industry.