Used DISCO DFG 841 #293818105 for sale

DISCO DFG 841 is a state-of-the-art wafer grinding, lapping and polishing equipment employed by many semiconductor companies. This system, when combined with DISCO-Plus wafer handling and polishing unit, provides complete automation for processing wafers with exceptionally high quality coefficients. This machine was designed to finish workpieces uniformly on large surface areas. It is able to achieve excellent surface finish results, as well as good roundness accuracy and precision diameters. This is due to its accurate and precise motion control technology, which results in excellent surface accuracy at low speeds, low vibration and improved surface finish quality. DISCO DFG841 features a large-ability 12-inch wafer capability and is capable of handling wafers up to 8 inches in diameter. This tool also offers high-speed grinding and polishing (up to 375 RPM) and allows users to grind and polish at the same time. The asset can also easily switch interchangeable tools to perform different processes including grinding, lapping, milling, and polishing. DFG 841 is driven by powerful motors with integrated speed controllers, capable of maneuvering the grinding wheel, lapping wheel and polishing wheel with precision. The model can also be programmed to perform wafer grinding, lapping, and polishing processes with specific parameters, such as speed, duration, and pressure. The Discoplan-Wafer handling unit is an optional accessory for DFG841. This allows the user to automatically and quickly feed wafers into the equipment. This is an easily operated user-friendly system that saves time and labor for and provides for a more efficient process. DISCO DFG 841 is encased in a sleek and sturdy stainless steel construction that offers protection from dust, heat, and moisture and is easy to clean and maintain. The unit also comes with a RS232 laptop interface for programming and a universal joystick for manual manipulation as well. This unit is an essential tool for semiconductor companies looking for precision wafer grinding, lapping, and polishing results. It is capable of delivering high quality, consistent results quickly and easily, making it an ideal choice for those looking for increased production and efficiency.