Used DISCO DFG 841 #9014573 for sale

DISCO DFG 841 is a fully automated wafer grinding, lapping, and polishing equipment designed for single-side surface processing of 200-300mm diameter wafers. It is designed to perform precision total thickness measurements down to a few hundredths of microns with no operator manipulation. The system utilizes an integrated CCD camera and laser detection unit to measure vertical and radial run out characteristics. The machine is equipped with a high-precision spindle and head assembly to ensure the highest accuracy with a resolution of 0.01μm. The head assembly can be programmed to move the grinding or polishing pads in a predetermined order, allowing for a fully automated process. DISCO DFG841 tool also features a polishing/etching station which allows for single-side defined pattern etching on the wafer surfaces, with a resolution of about 2μm. This can be used for fabricating functional components such as transistors, capacitors, edge curtains, wells, and other patterns. The etching feature can also be used to create uniformity in wafer thickness. The asset also features a lapping station which allows for uniformity in lapping operations such as thinning, planarization, and surface finish. The lapping station utilizes a spindle and table assembly for wafer mounting, rotation, and feeding. The dust collection model is designed to maintain a clean workplace and minimize chipping and abrasion. DFG 841 is designed with an impressive array of features to provide highly accurate wafer grinding, lapping, and polishing results. The combination of a high-precision spindle, laser detection equipment, and integrated CCD camera ensures that the results will meet customer specifications and tight tolerances. The additional features such as the polishing/etching station and the lapping station make DFG841 the ideal tool for industrial processing of microelectronics components.