Used DISCO DFG 841 #9035868 for sale

DISCO DFG 841 is a top-of-the-line wafer grinding, lapping, and polishing equipment designed for the production of high-quality semiconductor wafers. The machine is capable of grinding, lapping, and polishing wafers up to eight inches in diameter and is capable of producing wafers with exceptional flatness and surface finish. The machine consists of several components, including the grinding and lapping unit, the polishing unit, and the drying unit. The grinding and lapping unit performs grinding and lapping of wafers with the use of diamond-impregnated grinding wheels and disk lapping plates. This is done to achieve a high degree of surface finish. The polishing unit uses diamond-coated polishing pads to further smooth and refine the wafer surface. To finish the process, the drying unit removes any excess lubrication on the wafer's surface. DISCO DFG841's advanced grinding and polishing technology is precise enough to process wafers with narrowed nanometer slits and is capable of producing wafers with a maximum flatness of 10 nanometers. The system is designed to improve the process yield, lower scrap rates, and maximize wafer quality. DFG 841 is a fully automated, computer-controlled unit. It has a touch screen interface that allows users to easily monitor, set up, and adjust the machine settings. Parameters such as processing time, pressure, and speed can be adjusted to meet specific requirements based on the wafer material and customer specifications. DFG841 requires very little maintenance and is designed to meet the highest standards in wafer processing. It offers maximum throughput due to its high-speed grinding and polishing capabilities. This, coupled with its advanced control systems, makes for a perfect solution for any semiconductor wafer production.