Used DISCO DFG 841 #9102750 for sale

DISCO DFG 841 Wafer Grinding, Lapping and Polishing Equipment is a comprehensive and comprehensive system for processing semiconductor wafers. The unit combines precision grinding, lapping, polishing and cleaning processes in a single machine. It is designed to save both time and cost by combining all the processes in one machine. The machine utilizes diamond grinding and lapping discs, lapping films and polishing films to provide a high quality surface finish and perfectly flat wafer. The combination of the abrasive films and the lapping films provide a high degree of surface flatness, as well as removing surface defects and thinning wafer to a desired thickness. The polishing films are designed to provide a highly polished finish necessary for many semiconductor applications. A robust modular design allows for the interchange of modules for different process steps. The modules feature a linear motor-driven compact loader tool with a simple and intuitive graphical user interface. Each module is automatically tuned and calibrated with the software-controlled process parameters to provide reliable wafer processing. The asset includes a process monitoring model that can monitor process conditions such as angle, speed and force during grinding, lapping and polishing. This ensures consistent and repeatable process results. The process can be completely integrated into a computer-controlled equipment control unit that communicates with the robot control unit and enables the automatic loading and unloading of wafers between each process step. The system provides superior air-bearing and vacuum technology that enables the wafer to be placed on a surface that is specially designed to reduce friction and protect the wafer material surface. A back-up unit is also included, to ensure that the process is not suspended in case of power failure. The machine can be configured and customized to fit numerous processes in the same production line. The integrated process data analysis machine is designed to optimize process performance. This tool can trace process data and display it as periodical graphs to enable comprehensive process analysis. The asset also incorporates a statistical analysis package that can predict and control irregular events in the production, such as process overshoot. This ensures complete control to minimize wafer breakage or defects during the process. DISCO DFG841 Wafer Grinding, Lapping and Polishing Model is an ideal solution for semiconductor wafer finishing, providing reliable and repeatable process results.