Used DISCO DFG 841 #9164218 for sale

DISCO DFG 841 is a fully automated, high performance semiconductor wafer grinding, lapping and polishing equipment. It is designed to meet the requirements of the most advanced semiconductor wafer grinding and polishing technologies. The system offers micro- and nanotechnological advantages in the preparation of even very thin and high aspect ratio wafers, such as III-V (III-Vnitride, for example silicon-germanium and gallium arsenide) and compound semiconductor materials. The unit features a high degree of versatility due to its various operating modes, such as wet grinding and lapping, and dry grinding and polishing. The grinding and polishing stages are all pre-programmed and featured on a control panel for user convenience. The machine consists of a heavy duty base with grinder and optional cleaning station. The grinding and lapping process is carried out by two counterrotating cylindrical grinding wheels, which are opened up to a pre-selected distance and pressure. This pressure ensures that the grinding wheels deburr and polish the surfaces of the wafers. The optional cleaning station further improves the quality of the wafer surface before wafer release. The wet grinding and lapping operation is also possible, with a choice of several appropriate grinders and their respective consumables. The wafers are loaded to and from the tool via an automated wafer loader asset, and the model's mechanical settings can be adjusted with variable speed and pressure. The operating temperature can also be controlled, and the grinding speeds, pressures and fluid flows are adjustable, allowing maximum flexibility in processing various wafers. In addition, the equipment is equipped with a process monitoring system which can display different parameters, such as grinding speed and pressure and fluid flow. To ensure that the quality of the grinded wafer is as good as possible, DISCO DFG841 is equipped with a unique vision unit for inspecting the quality of the wafers. This vision machine can detect surface defects, scratches, dust particles and other characteristics of the wafer, enabling users to easily determine the processing quality of their product. As such, the tool is ideal for various grinding and lapping applications, especially when machine versatility, precision and cost effectiveness are of prime importance. This machine is suitable for both laboratory and production settings, as it can reduce experiment time and reach a higher level of productivity.