Used DISCO DFG 841 #9220941 for sale

DISCO DFG 841 is an efficient and reliable wafer grinding, lapping and polishing equipment, designed for use in semiconductor, Flat Panel Display (FPD) and other industries. It is capable of grinding and polishing of high quality and with low-cost consumables. DISCO DFG841 is equipped with an advanced spindle table feed system that can be set to accommodate various thicknesses of wafers. In addition, it is equipped with automatic edge detection sensors that ensure wafers are fed in the correct direction of rotation. This unit also boasts a wide range of adjustable spindle speeds and adjustable pressure, enabling precision grinding and polishing to meet precise requirements. The grinding and polishing process utilizes a 'pick and place' method, which quickly and safely places wafers onto the grinding and polishing pad. The machine is operated through intuitive touch-screen controls that allow for precise operation. In addition, it is equipped with an automatic polishing head unit to ensure consistent and repeatable polishing results. DFG 841 also features a range of standard safety features, including an emergency stop mechanism to protect the machine and operator, and a suitable enclosure to keep dust and other debris away from the grinding process. Finally, this machine is supported by DISCO comprehensive technical support staff, who can provide additional help to customize the machine and accessories to suit each customer's individual needs. Overall, DFG841 wafer grinding, lapping and polishing machine is a reliable and efficient machine that offers a range of features to achieve high-precision and cost-effective results. Its accurate and controllable grinding and polishing process, combined with the latest safety features, make it the ideal machine for semiconductor, FPD, and other industries.