Used DISCO DFG 841 #9232871 for sale

DISCO DFG 841 is a cutting-edge wafer grinding, lapping and polishing equipment utilized in a variety of microelectronics industries. This system allows for finish machining to be completed quickly and accurately due to its extensive range of features. This unit is capable of firing grinding and polishing with its high capacity abrasive media chamber and high-precision motor offering unparalleled control over the part finish. Furthermore, the machine also helps to guarantee improved productivity due to its high efficiency grinding chambers which can easily handle multiple wafers simultaneously. Lastly, the tool is equipped with a laser interferometer feedback asset which monitors grinding progress in real time, ensuring consistent results every time. The versatile DISCO DFG841 offers features that make it particularly useful for microelectrical operations. It offers four grinding and polishing capabilities in 4,000, 6,000, 8,000, and 10,000 RPM speeds including grinding discs, discs for flat grinding or the straight line technique, as well as grinding/polishing from different angles. It also features adaptive, auto-feed capabilities and sensors for wear monitoring and replacement of tools. The model is capable of pre-programmed and customized processing modes which can be adjusted on the fly for improved performance and increased throughput, and an automated controlled gating equipment to regulate the flow of incoming wafers. DFG 841 is also designed with operator's safety in mind. This is due to the system's self-monitoring capabilities which include emergency shut-off and quick-stop functions in the event of an unexpected interruption or fault. In addition to this, the machine also utilizes a wide range of specialized tools and accessories to optimize performance. These range from specialized grinding and polishing compounds, diamond slurry, alumina polishing pads, diamond discs, soft pads and more which can be used in combination and at various angles and depths for maximum finish. All these tools and accessories are designed to ensure the highest quality finish and accuracy for the desired surface topography. In conclusion, DFG841 is a state-of-the-art wafer grinding, lapping and polishing unit which offers superior accuracy, finish quality, throughput and safety to operators. Its comprehensive range of features makes it an ideal choice for microelectrical applications including precision polishing for wafer surfaces.