Used DISCO DFG 841 #9232872 for sale

DISCO DFG 841 is a versatile multi-functional wafer grinding, lapping and polishing equipment. It is designed to perform a variety of surface polishing, finishing, and precision grinding operations on semiconductor materials, including silicon wafers, disks, and optical parts. With an adjustable angle of tilt from 10° to 120°, the system can achieve optimal grinding, lapping, and polishing results. DISCO DFG841 uses low speed and precise grinding to achieve a smooth, uniform finish. This is achieved through a high-precision spindle-motor that can maintain its speed and torque over long periods of use. DFG 841 also features a high-precision numerical control that can precisely adjust the grinding parameters, and an integrated odometer that can measure and display the number of grinding cycles. Additionally, the unit features a water-cooled grinding wheel, enabling accurate grinding even at high speeds. DFG841 can also perform lapping operations for smoothing and polishing surfaces to an extremely high level of accuracy. Its diamond lapping plates feature high-viscosity oil delivery, allowing the diamond lapping fluid to be effectively and evenly dispersed. This ensures that the lapping and polishing process is highly efficient. The lapping plates also feature a double-pitch structure, which effectively reduces the variation of the lapping force. DISCO DFG 841 also ensures precision grinding and polishing with its high-precision grinding heads, which feature an ergonomically designed balance structure. The grinding heads are also equipped with an external dust collection machine, which reduces dust contamination for improved grinding productivity. Furthermore, the tool can easily be integrated with additional components, such as wafer chucks and cleaning systems, providing a complete automated grinding, polishing, and lapping solution. In summary, DISCO DFG841 automated wafer grinding, lapping and polishing asset provides a simple yet highly efficient way to complete precision surface grinding, polishing and finishing operations on a range of workpieces. Its adjustable angle of tilt, precise grinding head, and lapping plates enable the model to produce smooth, uniform surfaces, while its external dust collection equipment ensures a clean, dust-free working environment. This makes DFG 841 an ideal solution for those looking to achieve high-precision finishing operations in a variety of semiconductor materials.