Used DISCO DFG 841 #9243337 for sale

DISCO DFG 841 is a comprehensive wafer grinding, lapping and polishing equipment that delivers superior results and reliability. It is designed for advanced materials processing applications requiring the highest levels of quality and precision. DISCO DFG841 uses a flexible abrasive process that allows for precise removal of microns down to nanoscopic levels. The system features a unique, patented dual purpose grinding head which can be configured to grind samples with different levels of hardness; hard samples are ground with a high force and minimal movement while soft samples are ground with a low force and greater movements. The grindhead is mounted on a precision-controlled air bearing spindle that ensures accurate and repeatable results. The polishing station offers two methods for polishing wafers: conventional abrasive polishing or chemical-mechanical planarization (CMP). With conventional abrasive polishing, both soft and hard materials can be polished. With CMP, the materials are planarized by modifying the surface contours using chemo-mechanical action. The unit also features a lapping station which is designed to produce low surface roughness and superior flatness. The station delivers consistent, uniform results on both hard and soft materials. DFG 841 is easy to use and maintain and offers short cycle times. It is equipped with an intuitive human-machine interface (HMI) and offers a data logging and analysis machine that helps with operator training and process optimization. In summary, DFG841 is a high-performance grinding, lapping and polishing tool that delivers superior quality and precision. It is designed to efficiently process both hard and soft materials and offers superior performance, flexibility and reliability.