Used DISCO DFG 841 #9276810 for sale

DISCO DFG 841 is a professional wafer grinding, lapping, and polishing equipment used to process semiconductor and other materials to create the finest features and achieve exceptional levels of surface finish. This hybrid system combines the capabilities of conventional grinding and polishing systems with advanced lapping to produce high-precision wafers and fine pitch interconnects. The unit is designed for processing complex topographies on a variety of substrate and material types. The grinding capabilities of DISCO DFG841 are comprehensive, providing high-precision wafer grinding for fine pitch multi-layer interconnects as well as advanced lapping for high aspect ratio trenches and posts. The lapping process uses a diamond film abrasive material to achieve the desired micro-topography with reduced surface roughness and a low level of surface damage. The machine also includes features such as automatic size adjustment and programmable profile control to enable independent control of the lapping motion along the substrate for quick and accurate lapping of bumps, posts, and other fine pitch features. The tool's polishing capabilities enable superior surface finish and overall surface topography generation for a variety of materials. DFG 841 uses an electrostatic polishing asset which applies a current-controlled polishing material to the substrate, providing superior surface finish and fast process cycle times compared to traditional mechanical polishing. The model's advanced control processes allow independent control of polishing surface and depth within the same substrate, enabling the creation of complex architectures with high-precision and superior surface finish. Finally, the fully automatic polishing of DFG841 helps to ensure high-quality processing of multiple wafers in a single run with reduced cycle times. The equipment is designed for easy operation, with intuitive touchscreen operation and powerful edge detection algorithms that enable flexible profile and process control. The system also provides single-step loading and unloading to enable efficient and safe substrate handling and reduced contamination. Overall, DISCO DFG 841 is a powerful and highly versatile grinding, lapping and polishing tool designed to enable the creation of high-precision features on a variety of substrate and material types. This unit provides users with a comprehensive set of features and capabilities and is an excellent choice for achieving exceptional surface finish and topography on even the most complex material designs.