Used DISCO DFG 841 #9365784 for sale

DISCO DFG 841 is a wafer grinding, lapping, and polishing equipment used to provide fine surface finishes for semiconductor wafers. This 841 model is incredibly versatile as it features a 'single rotating building block system' with multiple applications, allowing users to efficiently switch between processes. The unit is equipped with a standard wafer chuck and a manually adjustable table that enable quick and easy wafer mounting, as well as slurry and diamond dispensing. It also features a microprocessor-controlled grinding head that is capable of providing a consistently accurate finish to wafers of different diameter sizes. The machine allows users to control the vertical and radial position of the grinding head, offering precise control over surface finish and surface roughness. The tool has a closed-loop grinding process using the CNC (Computer Numerical Control) asset, which automatically maintains the controlled parameters giving high-precision results. This machine is capable of grinding both sides of the wafer up to a relative roughness (RA) of less than 0.04 μm. The lapping and polishing process uses diamond paste to impart a high degree of surface finish on the wafer. The paste is distributed to the appropriate areas of the wafer using the adjustable lapping plate and air bearing back-pads. This allows users to create high-quality, near-smooth surface finishes. The wafer quality can then be objectively tested with the integrated laser interferometer. This model allows precise measurements of surface movement, vibration, and surface roughness. This helps users to check the accuracy and consistency of the finishing process. The entire equipment is designed for ease of operation and easy maintenance. It features an ergonomic console display that allows users to control all the grinding, lapping, and polishing functions linked together. The system also features touch screen user interface with multiple LED indicators and error messages to alert the users if any malfunctions occur, so that maintenance can be performed immediately if necessary. Due to its tremendous versatility, and user-friendly design, DISCO DFG841 wafer grinding, lapping, and polishing unit is the ideal choice for a variety of applications. It is especially suitable for producing high-quality wafers with smooth surfaces for the semiconductor and other high-end industries.