Used DISCO DFG 841 #9382569 for sale

DISCO DFG 841 is a wafer grinding, lapping, and polishing equipment that offers unmatched levels of accuracy, speed and reliability. This system was designed to accurately process high-quality semiconductor and electronics materials, such as silicon, germanium and other related substrate materials. DISCO DFG841 unit features a high-performance grinding spindle assembly, equipped with advanced digital controls, and is designed to provide uniformity, repeatability and speed to ensure the highest quality surfaces possible. This machine also has a top-of-the-line measuring tool, to accurately assess and monitor the customer's process parameters and manufacturing outcomes. The wet grinding process used in DFG 841 asset is suitable for applications such as face grinding, edge grinding and back grinding, and can be used to achieve the most excellent surface finish and vital dimensions. An embedded, compact abrasive slurry technique is also employed to increase the grinding speed and yield a precise machining surface. DFG841 model also features an automated lapping process, which is perfect for a variety of precise and delicate components. The automated lapping process ensures controlled uniformity on special materials and components, with minimal manual intervention.The built-in equipment also provides precise control methods that can ensure extraordinary control, stability, and accuracy for the lapping process. DISCO DFG 841 also has a specialized polishing process that can provide precise, repeatable, and accurate results. This system is designed to reduce disputes between customers and vendors, as well as limiting the potential for human-induced errors. The advanced digital controls ensure smooth and accurate polishing, providing unsurpassed levels of cleanliness and accuracy. Overall, DISCO DFG841 unit provides an unrivaled grinding, lapping and polishing process, which enables users to achieve the desired surface finish and tight tolerances needed for micro-electronic components and semiconductor materials. The machine offers precise control methods, excellent repeatability, and high accuracy so that customers in the microelectronics industry can feel confident they are receiving the highest quality product and manufacturing techniques.