Used DISCO DFG 841 #9394963 for sale

DISCO DFG 841 is a revolutionary wafer grinding, lapping, and polishing equipment designed specifically for the microelectronics industry. DISCO DFG841 features a revolutionary 'smart' robotic arm for precise and efficient wafer processing - making it significantly more efficient than traditional wafer grinding systems. DFG 841 is constructed with a solid modular design to increase accuracy and durability of the machine. Each module can be individually set up to meet specific customer needs. The machine is equipped with a 4-axis robotic arm that is capable of operating at high speeds with extreme accuracy. It can handle up to eight wafers simultaneously with a minimum indenter rotation accuracy of 0.2 degree or less. Furthermore, the wafer grinding capacity is capable of handling diameters from 50mm to 250mm. This makes it suitable for all types of wafer processing requirements. DFG841 uses a combination of air jet and abrasive disk grinding for precise grinding and polishing of the wafers. Along with this, the machine also features a pressure measurement schedule to ensure optimal grinding conditions. Achieving superior surface quality and precision polishing is made possible by using fine ceramic crystals. This eliminates the need for diamond compounds which increase cost without a noticeable quality benefit. The machine is equipped with a newly developed programmable control system which enables precise wafer machining processes. Additionally, it is powered by a state of the art inverter unit which enables fast acceleration and deceleration of the grinding process. Such features enhance the machine's precision and accuracy which is of the utmost importance when it comes to reaching ultra-high quality microelectronic wafer requirements. To ensure optimal wafer grinding and polishing operations, the machine is equipped with various safety features. These include a micro-processor backup memory machine, an emergency stop unit, and an ergonomically designed work area which reduces operator fatigue and increases overall productivity. All in all, DISCO DFG 841 is a highly efficient and precise wafer grinding, lapping, and polishing tool designed for the microelectronics industry. With its innovative robotic arm, superior surface quality, and safety features it is guaranteed to exceed customer expectations.