Used DISCO DFG 850 #293593026 for sale

DISCO DFG 850 is a state-of-the-art wafer grinding, lapping and polishing equipment designed for cost-effective, high accuracy processing of semiconductor wafers. It uses a bi-axial gantry to provide a superior level of mechanical rigidity and excellent low distortion characteristics, while the abrasive media is accurately centralized and driven along constantly-variable speeds by ultra-precise torque-controlled spindles. The abrasives are held in place by a clamp system, and the wafers themselves are held in place on a spindle-table, designed to facilitate uniform polishing and superior machining accuracy. The unit is capable of processing wafers with diameters ranging from 2.36" to 8" and features an intuitive, user-friendly CNC control machine, allowing operators to monitor process conditions and make precision adjustments in real-time. DISCO DFG850 is an advanced tool, with unique features such as active media flush, zone tracking, and active media optimization, allowing maximum performance from the abrasives and also reducing the risk of chips embedding themselves into the workpiece surface. The vacuum asset also maximises processing stability, minimising vibrations and thus guaranteeing excellent surface finish and high material removal rates. DFG-850 is designed to automate multiple grinding, lapping and polishing operations and to deliver cost savings, process reliability, and machining accuracy through the use of high performance, fully programmable model components. The equipment has numerous safety and maintenance features, including grating level, contamination detection, and air filter alarm functions, to ensure a safe working environment and to maintain a high level of performance over time. Overall, DFG 850 is a versatile, robust and reliable wafer grinding, lapping and polishing system, designed to meet the needs of modern semiconductor processing operations when superior quality and accuracy at low cost are needed.