Used DISCO DFG 850 #293616891 for sale

DISCO DFG 850 is a state-of-the-art wafer grinding, lapping and polishing equipment that provides an efficient, versatile, accurate and economical solution for substrate and wafer processing needs. DISCO DFG850 is a fully automated system that combines wafer grinding and polishing with high throughput and uniform performance. It is designed to process substrates and wafers that range in size from 2" to 12" with a minimum thickness of 0.3mm. The unit features multiple grinding stages, a dedicated polishing stage, and a unique high-resolution, high-speed digital imaging machine. The tool is equipped with a large working chamber and a flexible, ergonomic design to facilitate easy access and convenient operation. A special automatic load/unload cycle, transferred with a conveniently located robot and wafer loader, aids in increasing throughput and reducing operator time. The asset also has various grinding and polishing tools that are capable of handling a wide range of substrates and wafers, including slurry-type abrasives and grinding/polishing plates. In addition to its grinding and polishing components, the model also features a high-resolution, 640K pixel high-speed digital imaging equipment. This system is capable of inspecting, judging and controlling the surfaces of the samples within the same working chamber, with accuracy of 0.1um. It also has a real-time control unit that is capable of processing data, making estimations and decisions about the samples, and transferring the results to a computer for further analysis. These features, combined with its robust design, makes DFG-850 the perfect solution for wafer grinding, lapping and polishing needs. Its precise processing, versatile functions and reliable performance make it an ideal choice for a wide range of applications, from simple processing to the most precise substrate manufacturing. Its flexibility and affordability help ensure that it will be a valuable asset to any lab or fabrication facility.