Used DISCO DFG 850 #9144941 for sale

DISCO DFG 850
ID: 9144941
Wafer Size: 8"
Back grinder, 8".
DISCO DFG 850 is a state-of-the-art, high-precision wafer grinding, lapping, and polishing equipment. It is designed to perform the full range of wafer finish operations, from the initial grinding process, to the finishing process. DISCO DFG850 is compatible with most wafer sizes, and is capable of producing high-quality finishes. This piece of machinery is equipped with a variety of grinding wheels to suit the specific requirements of the application. The motor is variable speed, allowing the user to achieve the desired finish in whatever speed they need. The lapping bed incorporates a unique quick-change system, which makes it easy to switch between different types of lapping mediums. The entire unit is controlled through a touch-screen panel, which includes a programmable memory setting. This memory setting can be set to store the required parameters for each grinding process, allowing for quick and optimized results. DFG-850 also features a set of diamond grinding wheels for extra fine grinding. The wavelength of these wheels is adjustable, creating a precise and consistent finish. The machine is further equipped with a polishing bed, featuring a range of diamond polishing films and slurries. The films are used to refine the surface, while the slurries are employed to remove the post-grinding marks. DFG850 is designed for safety and ease of use, featuring an ergonomically designed and safe working environment. The workpieces are held in place using a vacuum tool, using a flexible clamp to ensure their secure positioning. The machine is also overload proof, with automatically stopping when it exceeds power capacity. Finally, the machine is built to last, featuring a rugged construction with dustproof enclosure and built-in safety systems. It is also factory-calibrated to ensure continuous precise results. All in all, DISCO DFG-850 is an unbeatable wafer grinding, lapping, & polishing asset.
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