Used DISCO DFG 850 #9158359 for sale

DISCO DFG 850 is a state-of-the-art wafer grinding, lapping, and polishing equipment. The system's versatile design, coupled with its high-performance capabilities, make it the processing solution of choice for many advanced semiconductor fabrication and research facilities. DISCO DFG850's unique configuration includes advanced control components essential to meeting tight production requirements. The unit is capable of controlling both grinding, lapping, and polishing operations simultaneously, with precision and superior skill. The advanced manufacturing process controller provides comprehensive control with a variety of operating parameters and user-friendly programming capabilities. In addition, the optional autoloader machine accommodates the efficient processing of production jobs with the built-in robotics and programmable control functions. The high-performance grinding, lapping, and polishing station provides unsurpassed accuracy for semiconductor fabrication. The tool offers a wide range of work pieces that can be processed simultaneously, including many kinds of materials. The ability to customize the parameters for each type of substrate on the asset ensures optimal process results. At the core of the model is a grinding and polishing unit with adjustable speed, pressure, and cut rate that allow for easy adjustment and optimization of the grinding and lapping process. The equipment offers a range of grinding and lapping tools that can be tailored to the exact needs of the process. The programmable segmentation offers unparalleled precision along with high repeatability, providing the highest quality production results. DFG-850 also offers a full suite of safety features, including an emergency stop button, safety interlocks, and a safety cover for the spindle. All of these features work together to ensure that operators remain safe during the grinding and lapping process. DFG850 is a powerful and reliable wafer grinding, lapping, and polishing system, providing the highest levels of accuracy, precision, and efficiency. The unit's versatile configuration and advanced control capabilities make it the ideal choice for achieving consistent and reliable results in semiconductor fabrication and research.