Used DISCO DFG 850 #9208199 for sale

DISCO DFG 850 is an advanced wafer grinding, lapping, and polishing equipment that is used in semiconductor manufacturing. This system is known for its ability to produce semiconductor wafers that are nearly flawless. The key features of DISCO DFG850 include advanced vacuum processes, sophisticated grinding and lapping tools, and precise polishing technology to achieve state of the art performance. The vacuum processes allow for efficient dust prevention and air pressure control which are essential for producing the highest quality wafer surface. With the sophisticated grinding and lapping tools, DFG-850 applies the necessary pressure to meet specific requirements. Polishing is also taken care of with precision. The unit is equipped with one of the most modern polishing technologies available, enabling it to produce wafers with an extremely smooth and flat surface. The machine also offers efficient operation and easy maintenance. Measurements and adjustments can be made quickly and accurately. The on-board user interface, monitoring tool, and diagnostic software make it easier to operate and troubleshoot. The asset is also equipped with safety features to ensure maximum protection. Using DISCO DFG-850 results in production times that are faster and yields greater than ever before. It is a cost effective way to produce quality wafers that are needed for applications such as LED, solar cell, and optical component production. Moreover, with its fast operation, low maintenance and environmental protection features, DFG850 is a great choice for any semiconductor fabrication factory.