Used DISCO DFG 850 #9232685 for sale

DISCO DFG 850 is a high-precision wafer grinding, lapping, and polishing equipment designed for use in semiconductor, MEMS, and optoelectronic device fabrication and production. A single system can be used to grind, lap, and polish a wide variety of substrates and can be easily reconfigured to accommodate multiple process applications. The heart of DISCO DFG850 is its fully integrated wafer grinding unit. Its unique design allows grinding on both the surface and the edge of the substrate, thus enabling high precision sharp edges and superior surface finish. The unit features an exclusive servo-driven, multi-axis grinder head that is capable of producing the finest of surface finish and clarity. It has an integrated air bearing machine for low vibration, allowing for unprecedented accuracy and repeatability in the grinding process. In addition to the wafer grinding unit, the tool includes a multi-function rotary table, which can tilt, spin, or move around in three dimensions. It also includes a multi-spindle spindle taper grinding attachment, allowing for simultaneous grinding of multiple surface areas. DFG-850 also includes a two-stage lapping process which guarantees superior surface finish and quality. This process consists of two separate grinding discs, the first of which is used to grind the wafer edges and the second to polish the entire surface. The "active area" (the area in which the tool creates the top surface) is highly accurate and adjustable, allowing for more precise machining times and greater repeatability. DFG 850 also offers a wide range of options for polishing, enabling it to be used for a variety of applications. This includes a multi-function diamond polishing asset, which carries out ultra-precise polishing of metal films, flat panels, and other substrates. It also features a range of diamond tools, including lapping films and compound polishing pads, which can achieve superior surface finish and clarity. DFG850 is designed to perform at the highest levels of accuracy, repeatability, and precision. Its flexibility and range of applications make it an attractive and cost-effective choice for manufacturers in the semiconductor, MEMS, and optoelectronics industries.