Used DISCO DFG 850 #9249940 for sale

DISCO DFG 850 is a wafer grinding, lapping and polishing machine designed for use in the production of integrated circuit (IC) devices. The machine is capable of grinding, lapping and polishing highly precise and complex shapes of ICs with minimized edge imperfections. DISCO DFG850 is designed with a modular platform that allows for installation of optional, tailored components for each application. DFG-850 is equipped with a spindle, an abrasive wheel and a rotate mechanism for lapping and polishing the substrate. The spindle can rotate at speeds up to 2,500 RPM and is capable of holding abrasive wheels with a diameter of up to 8 inches while providing a range of grinding and lapping movements. The abrasive wheel can be exchanged depending on user requirements, allowing for different levels of polishing precision. The machine is also equipped with an ergonomically designed wafer holder that is optimized for wafer handling and positioning. The wafer holder is capable of holding up to 8 wafers of up to 8 inches in size. The holder is installed on a vibration-damping, air-bearing table that provides smooth movement and controlled air flow throughout the grinding, lapping, and polishing processes. DISCO DFG-850 also features a user-friendly control panel with a graphical user interface (GUI). The control panel allows users to intuitively program and monitor the grinding, lapping, and polishing steps. The machine is also equipped with sensors and safety devices to ensure a safe operation. DFG 850 is the perfect tool for a variety of semiconductor applications requiring tight surface finish and dimensional accuracy. Its modular design and intuitive user interface make DFG850 an ideal choice for high-precision grinding, lapping and polishing applications.