Used DISCO DFG 850 #9311762 for sale

DISCO DFG 850 is a state-of-the-art wafer grinding, lapping and polishing system. It is a highly automated, high precision system capable of achieving exceptional flatness and surface quality on a variety of materials. The machine comprises of a main frame, a workpiece table, a spindle head and grinding unit, a control cabinet, lapping units and a polishing unit. The spindle incorporates an integral motor and is capable of rotation in both clockwise and anti-clockwise directions at variable speeds in order to achieve a range of grinding processes. This spindle head is also precision translated along the axis of the grinding table, enabling controlled grinding, lapping and polishing processes. The workpiece table is driven by a dual-axis motor allowing the workpiece to be positioned both horizontally and vertically. This allows for the precise control of the workpiece in both the X and Y axes for demanding cutting and grinding operations, whilst also providing excellent wafer-level flatness and accuracy. The control cabinet is a key component of the machine and includes the PLC, safety, digital control, vision and user interfaces. This cabinet can be fitted with a variety of digital imaging equipment in order to monitor and characterise the wafer surface during the grinding, lapping and polishing processes. Lapping and polishing are achieved through diamond films, films and consumables. The films are secured to the workpiece using magnetic holders and enable precise control of the polish process. The machine is also equipped with various polishing, de-smearing and cleaning features in order to ensure a perfect wafer finish. In summary, DISCO DFG850 is a robust, reliable and highly precise grinding, lapping and polishing system. It can produce exceptional flatness and surface quality on a variety of materials whilst also delivering precision control and digital imaging. This makes it the ideal solution for a range of precision applications, from microelectronics to semiconductor and optoelectronic components.