Used DISCO DFG 850 #9379502 for sale

DISCO DFG 850 is a high-performance wafer grinding, lapping and polishing equipment used for processing and smoothing surface layers of semiconductor and other materials. The system provides superior overall productivity and high-precision process control due to its sophisticated grinding, lapping, and polishing technology. The unit is suitable for machining various materials such as silicon, polysilicon, and sapphire. The machine features a base unit, an X-Y platform, and a polishing control head. The base unit houses all the necessary electronics including the grinding and polishing heads, control electronics, drives, power supplies and vacuum tool. The X-Y platform provides precise and controlled motion for the grinding and polishing heads. The polishing control head adjusts the speed, pressure and angle of the grinding and polishing heads to optimize the polished results. In addition, the asset has a unique wafer removal model, which allows for automated wafer loading and unloading. This wafer removal equipment can process up to 600 wafers per hour, greatly reducing cycle time. Wafer sizes accepted range from 4" to 230mm and frame sizes range from 4"x4" to 12"x12". The system provides precise and repeatable processing with an accuracy of 0.5 µm. Its concentration of process media allows for a controlled level of chemical attack along with a high degree of compaction. The low-vibration design ensures an even surface polishing that is free of defects. DISCO DFG850 unit is highly reliable and comes with a full range of safety features including door interlock and emergency stop. It boasts a wide selection of options for automation and process control. Overall, this machine is an invaluable component for the industrial production of semiconductors and other materials.