Used DISCO DFG 8540 #293605954 for sale

DISCO DFG 8540 is a wafer grinding, lapping, and polishing equipment that is designed to produce precise thin wafers for various semiconductor applications. This system uses an intelligent control unit to automatically grind, lap, and polish without operator intervention, allowing for greater efficiency and consistency. The machine is designed to support a wide range of wafer sizes and materials, including crystalline and non-crystalline wafers, ranging from 3-inch to 12-inch in diameter. DISCO DFG8540 is designed with a compact footprint, which makes it suitable for larger production lines. The tool's ability to quickly and consistently achieve high-quality wafers is made possible thanks to its ultra-high accuracy polishing head, capable of polishing up to 1000WPM (wafers per minute). The asset features a high-speed grinding unit that utilizes advanced three-dimensional abrasive heads for faster and more precise grinding of various materials. The grinding unit also incorporates a low-profile design that allows for better accessibility in restricted spaces. DFG 8540 comes with a variety of optional features that help to customize the model for specific production requirements. The equipment is built with an auto-mode system that is capable of automatically handling different wafer sizes, while the auto-loading unit quickly and accurately handles different wafer sizes and shapes. Additionally, the machine can be equipped with a load palletizing function that facilitates easier and safer handling and loading of wafers. Incorporating numerous other functions and components as well, DFG8540 is designed to minimize operator intervention while providing outstanding results. This semi-automated tool can reduce an operator's workload, increase production output, and help to ensure superior product quality at the same time.