Used DISCO DFG 8540 #9138237 for sale
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ID: 9138237
Wafer back grinder
Workpiece : Silicon wafer
Sample wafer provision : with (200mm)
Wafer thickness :
o 8"mm wafer
Thickness after processing : 100um, 200um,150um
o 6" wafer
Thickness after processing : < =300um
Protective tape
Wheel selection (for Z1:fine grinding) : BT 300
Wheel selection (self-grinding) : Disco suggestion
Dresser board :
Z1 wheel : Part no : DISCO
Z2 wheel : Part no : DISCO
Default cassette setting : Open flow (transfer to opposite cassette)
Stage A:
8" A192-80M
8" double slot cassette
sample of cassette
Stage B:
8" A192-80M
8" double slot cassette
sample of cassette
Adjustable cassette setting 1:
open flow(transfer to opposite cassette)
Stage A:
6" A194-60MB
6" double slot cassette
Sample of cassette
Stage B:
6" A194-60MB
6" double slot cassette
sample of cassette
Default display language : English
Z1
Height gauge stroke : 1.8mm(max.)
Z2
Height gauge stroke : 1.8mm(max.)
Power voltage
Power frequency : 60Hz
Attached hose : 5M
Safty lables : English
Paint color:
Cream
Standard color (munsell#2.5GY8.0/0.5)
Black
Standard color munsell#N 2.4
Manuals:
First set : English (for standard specification)
Second set : English (for standard specification)
Transport parts :
6" to 8"
Optional accessories (included with shipment) : 8" dedicated transport parts
Optional accessories (Thin grinding specification) : 6" decicated, 8" dedicated
Chuck table : Universal (4" to 8")
Wafer size selection for universal chuck table: 5",6",8"
Double slot cassette for thinly ground waters :
6" dedicated double slot cassette
8" dedicated double slot cassette
Lifting jig set
Power cable for main unit : with (5m/transformer for main unit is used)
Site-side piping joints : Including water temperature control unit (DTU152)
Automatic setup function
Transformer for main unit CM:with (voltage: 220 V)
Water temperature control unit (DTU152) : with (English manual attached)
Transformer for water temperature control unit : with (voltage :220 V)
Power cable for water temperature control unit: with (5m/transformer for DTU152 is used)
Duct unit
Uniterruptible power supply unit
Vaccum maintance function
Equip 8" & 6" wf thin grinding necessary parts
8" wf parts with shipment for main product
Capacity : 5 m3/min
2010 vintage.
DISCO DFG 8540 is a compact, feature packed wafer grinding, lapping and polishing equipment designed to meet the maximum requirements of the semiconductor and optics industry. This robust system is equipped with advanced control functions and is capable of achieving precision levels up to 0.1um, making it a perfect tool for nano-technologies. The primary components of the unit include a grinding and polishing head, grinding plate and a main body frame. The grinding head is powered by an AccuForce-I grinding drive motor and is capable of rotating at a maximum speed of 12,000 rpm. The grinding plate is equipped with a direct-drive motor and is capable of rotating at speeds up to 10,000 rpm for repeatable accuracy up to 0.1um. The main body frame is designed to keep all the components firmly together and features an integrated control panel that allows easy access to all the machine parameters. The tool comes equipped with a signal control software package, allowing easy operation of the asset and real-time control of the grinding and polishing processes. It also features a user-friendly graphical interface and displays the grinding and polishing status in real-time. The latter makes it easy to monitor the entire process and maintain high-quality results. The model is also capable of storing and transferring customer data, making it an ideal tool for collaborative projects. Finally, DISCO DFG8540 is equipped with several safety features, including a dual-layer protective housing for the grinding and polishing head, as well as a safety door to prevent unauthorized personnel from accessing the equipment. These features, when combined with its accuracy and reliability, make DFG 8540 a reliable tool for wafer grinding, lapping and polishing applications.
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