Used DISCO DFG 8540 #9145552 for sale

DISCO DFG 8540 is a wafer grinding, lapping, and polishing equipment that is used for processing semiconductor wafers in the back-end semiconductor device manufacturing process. The system utilizes a combination of the latest grinding and polishing technologies to achieve superior wafer surface roughness, flatness, and uniformity. The machine is specifically designed for efficient and accurate production of silicon and compound semiconductor materials. DISCO DFG8540 has a unique grinding/lapping/polishing table that has an advanced servo-controlled unit to precisely control grinding, lapping, and polishing operations. It has a powerful multiple grinding/lapping/polishing head structure which provides the highest productivity. The machine also features a wide range of attachments that enable it to accommodate wafer sizes and surface roughness requirements. DFG 8540 has a high detection accuracy and repeatability rate, as well as self-diagnosis and automatic wafer exchange features. The tool's software is designed to allow operators to set and customize the parameters to meet the customer's specific needs. It also offers an auto tuning asset that can automatically adjust the parameters to maintain optimal operation of the model. Furthermore, the equipment has a wide selection of lapping fluids that can be used to enhance the uniformity of the wafer surface. The system also has an integrated contamination control unit that ensures that the wafers are free from dirt and other particles during the lapping/polishing process. It also has a flexible machine for loading and unloading wafers, allowing for easy and precise loading and unloading of the wafers. DFG8540 also comes with a variety of accessories that provide additional safety and efficiency. This includes safety guards, a protective cover, an exhaust gas filtering tool, and a safety unit which can automatically shut off the asset when an emergency stop switch is used. In conclusion, DISCO DFG 8540 is a powerful and versatile wafer grinding, lapping, and polishing model that can accurately and quickly process semiconductor wafers to the highest surface roughness, flatness, and uniformity. Its advanced servo-controlled equipment and flexible loading and unloading features provide superior operation and convenience. Its integrated contamination control system ensures that the wafers are not contaminated during the process, while its wide array of accessories offer additional safety and efficiency.